Epic Resins has formulated a host of materials designed to be used in microelectronic applications.  Our consistent quality means that you will have a repeatable process for high volume production.  Below are a few examples of the polyurethane and epoxy resin potting materials that are being used in the manufacture of microelectronics devices.

Epic S7356

Epic S7356 two component polyurethane potting compound was specifically formulated for automotive sensors, switches, and other electrical devices requiring protection from "under the hood" environments.  Epic S7356 has successfully passed automotive thermal shock and thermal cycling evaluations and has also proven itself in the field in a wide range of automotive applications.  The S7356 features a convenient 1:1 by volume mix ratio and low viscosity that makes it very accommodating to meter mix and dispense applications.  Another key feature of this system is that it offers a very fast room temperature gel time in a small mass making it an excellent system for applications requiring small amounts of potting.  The fast gel time also provides the advantage of rapid cycling of parts.  The Shore A = 60-65 hardness range is also a valuable feature that allows delicate components to expand and contract when exposed to temperature swings without causing physical stress that can create failures. 

Epic S7360

Epic S7360 is a clear, two component polyurethane electronic potting and encapsulating compound.  S7360 is designed with a low hardness and good electrical properties which make it an excellent replacement for silicones.

Epic S7130

Epic S7130 is a two component epoxy potting/encapsulating compound.  S7130 has been designed for the potting/encapsulation of small components where a fast cure at room temperature is an important design criteria.  S7130 features a convenient 2:1 by volume mix ratio and is well suited for small shot dispensing on meter-mix dispense equipment.