Epic Resins has a full line of electronic potting compounds designed to protect your control module from the elements, whether chemical or natural in nature. Our epoxy and polyurethane encapsulants are used in environments that require good thermal shock and vibration resistance, as well as resistance to harsh chemicals.
Epic S7310
Epic S7310 is a black two component urethane potting compound that features: 1) Low viscosity 2) 1:1 volumetric mix ratio 3) Good resin/hardener compatilbility 4) Good durometer stability after exposure to elevated temperatures. Based on thermally aging data, Epic S7310 will work in the -55C to 125C operating range, providing stress relief to sensitive surface mount components.
Epic S7351
Epic S7351 is a two component, room temperature cure, polybutadiene based polyurethane potting compound. Epic S7351 was specifically formulated for electronic marine modules (EMM's) and is also an excellent candidate for electronic control modules (ECM's). Due to its low hardness and flexibility, S7351 will not exert stress on delicate surface mounted devices (SMD's) on printed circuit boards (PCB's) when exposed to extreme thermal cycling typical of marine and automotive electronics applications. This polyurethane potting compound is an excellent alternative to rigid systems that do not allow expansion and contraction of delicate components, causing failures. Also, due to the polybutadiene chemistry used in this formula, the product provides excellent high temperature properties up to 125C and much improved chemical resistance.
Epic S7285
Epic S7285 is a two component polyurethane potting compound that was formulated for potting electronic control modules (ECM's). The low mixed viscosity of S7285 allows the material to flow into intricate places under printed circuit boards and other tight tolerance areas in a wide variety of electronic devices. Another key property of this product is the 4:1 by volume mix ratio that makes the system very adaptable to meter mix and dispense applications. Offering a hardness of Shore OO = 50-65, S7285 provides excellent flexibility, therefore allowing delicate surface mounted devices (SMD's) to expand and contract during thermal shocks and thermal cycling. This polyurethane potting compound is also flame retardant, being UL 94V0 recognized at 5.4mm. For applications that generate a great deal of heat, this product is also an excellent choice due to its low weight loss at elevated temperatures. S7285 has shown extremely low weight loss at 130C - 0.24% after 168 hours.
Epic S7391
Epic S7391 is a two component polyurethane gel potting compound designed for potting sensitive electrical components. Epic S7391 features a convenient 1:1 volumetric mix ratio as well as a very low mixed viscosity. Epic S7391 encapsulating urethane makes an excellent replacement for more expensive silicone potting materials.
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pic S7325
Epic S7325 is a low hardness aromatic urethane potting compound. S7325 has been designed with a convenient 1:1 by volume mix ratio. Epic S7325 is especially useful for applications requiring removal of the potting material for easy access to circuitry and components so that repair can be performed on expensive control modules. S7325 has a proven track record of performance in under the hood automotive applications.
Epic S7302
Epic S7302 is a tough, medium durometer, polyurethane potting and encapsulating material. S7302 is a room temperature cure system that may be accelerated by increased temperatures. S7302 is suitable for applications that require operating temperatures between 110 to 120C. Epic S7302 exhibits good adhesion to many types of thermoplastic cases, without the need for surface preparation. Epic S7302 is a great product for applications that will see vibration, thermalcycling and/or thermal shock.
Epic S7287
Epic S7287 is a low cost, two component polyurethane potting compound that is used in various electrical and electronic potting applications. Epic S7287 features a low viscosity which imparts good flowability for the ease of potting of parts. Epic S7287 is recommended for products that require the encapsulating compound to flow into intricate and tight tolerance designs.
