Potting and Encapsulating for Control Modules

Choose from a full line of electronic potting compounds designed to protect control modules from the elements, both chemical or natural. These resins are excellent for potting and encapsulating a variety of small, sensitive electronics. Low viscosity compounds easily reach the intricate, detailed parts of control modules and other similar electronic devices. Sensitive components are well protected and held stable with any of our high-quality electric potting compounds.

Our epoxy and polyurethane encapsulants are used in environments that require good thermal shock and vibration resistance, as well as resistance to harsh chemicals. Many of our potting materials are UL rated and certified for enhanced fire resistance.

Popular Control Module Compounds:

Epic S7310 is a black two-component urethane potting compound that features:

  • Low viscosity
  • 1:1 volumetric mix ratio
  • Good resin/hardener compatibility
  • Good durometer stability after exposure to elevated temperatures.

Based on thermally aging data, Epic S7310 will work in the -55°C to 125°C operating range, providing stress relief to sensitive surface mount components.

Epic S7475 is a two-component polyurethane compound for potting ECM’s and a wide variety of electronic devices. The low mixed viscosity of the S7475 allows the material to flow into intricate areas under printed circuit boards and other tight tolerance areas. It has a 4:1 by volume mix ratio that allows the system to be very adaptable for meter mix and dispense processing. The very low hardness of S7475 in combination with the low Tg provides excellent flexibility, allowing delicate SMD's to expand and contract during thermal cycling and thermal shock.

S7475 has shown extremely low weight loss at 130°C. S7475 is UL 94 V-0 recognized at 4.8 mm and is RoHS compliant.

Epic S7325 is a low hardness aromatic urethane potting compound. It has been designed with a convenient 1:1 by volume mix ratio. This material is especially useful for applications requiring removal of the potting material for easy access to circuitry and components so that repair can be performed on expensive control modules. S7325 has a proven track record of performance in under the hood automotive applications.

Epic S7351 is a two-component, room temperature cure, polybutadiene based polyurethane potting compound. It was specifically formulated for electronic marine modules (EMM's) and is also an excellent candidate for electronic control modules (ECM's). Due to its low hardness and flexibility, it will not exert stress on delicate surface mounted devices (SMD's) on printed circuit boards (PCB's) when exposed to extreme thermal cycling typical of marine and automotive electronics applications. This polyurethane potting compound is an excellent alternative to rigid systems that do not allow expansion and contraction of delicate components, causing failures. Also, due to the polybutadiene chemistry used in this formula, the product provides excellent high-temperature properties up to 125°C and much-improved chemical resistance.

Epic S7391-03 is a two-component polyurethane gel potting compound designed for potting sensitive electrical components. It features a convenient 1:1 volumetric mix ratio as well as a very low mixed viscosity. Epic S7391-03 encapsulating urethane makes an excellent replacement for more expensive silicone potting materials.

Epic S7287 is a low cost, two-component polyurethane potting compound that is used in various electrical and electronic potting applications. It features a low viscosity which imparts good flowability for the ease of potting of parts. Epic S7287 is recommended for products that require the encapsulating compound to flow into intricate and tight tolerance designs.

Epic S7302 is a tough, medium durometer, polyurethane potting and encapsulating material. It is a room temperature cure system that may be accelerated by increased temperatures. This formula is suitable for applications that require operating temperatures between 110°C to 120°C. It exhibits good adhesion to many types of thermoplastic cases, without the need for surface preparation. Epic S7302 is a great product for applications that will see the vibration, thermal cycling, and/or thermal shock.

Custom Formulations for Control Modules

From cure times to hardness and viscosity, we have the capability to adjust our formulas to better match the resin requirements of your control module or electronic component part. Our technicians work with you to get a formula to match your specifications, then thoroughly test the product in simulated environments to best match your needs.

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